AMD Epyc 7303 2.4GHz Processor 16 Core for Socket SP3 Tray
CPU Processors

AMD Epyc 7303 2.4GHz Processor 16 Core for Socket SP3 TrayCode: 50866487

Key features:

  • Zen 3 Microarchitecture
  • Threads: 32
  • Maximum Frequency: 3.4 GHz
  • Cache Memory: 64 MB
  • Locked
  • Thermal Design Power (TDP) 150 W
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656,00
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  1. Epyc 7303 2.4GHz Processor 16 Core for Socket SP3 Tray

    Store information
    656,00 €

Description

The AMD Epyc 7303 processor is based on the Zen 3 microarchitecture (2023). It features 16 cores with 32 threads. More cores provide increased power for programs that take advantage of a larger number of cores. Threads allow the processor to execute multiple applications simultaneously, performing tasks faster. Its maximum frequency is 3.4 Ghz.

It incorporates a 64 MB cache memory. Cache memory is a very important feature, as the larger it is, the less time the processor requires to retrieve data from the computer's main memory, significantly increasing performance.

It has the SP3 socket and will need to be hosted on a motherboard with a corresponding socket. Finally, a cooler is not included. You will need to purchase a separate cooler for the processor, which is necessary.

The Epyc 7303 is chosen for professional server systems and workstations where high processing power is required in areas such as artificial intelligence and high-performance computing (HPC), thanks to its large memory bandwidth and exceptional I/O.

The "Zen 3" microarchitecture processors are designed for gaming, offering up to 19% higher performance compared to previous generations, combined with up to 24% lower power consumption. They have greater bandwidth, contributing to increased performance. The large cache memory, twice that of "Zen 2," promises minimal delays in communication between cores, which gamers will fully exploit. For example, gamers in 1080p games will experience an average performance increase of 26%.

Manufacturer

AMD

Specifications

Main Specifications

Year of Release
2023
Family
Epyc
Microarchitecture
Zen 3
Socket
SP3
Packaging
Tray
Compatible Chipset
-

Performance

Cores
16
Threads
32
Processor Frequency (Base Frequency)
2.4 GHz
Max Processor Frequency
3.4 GHz
Cache memory
64 MB
Unlocked
No
Thermal Design Power (TDP)
150 W

Features & Functions

Includes Heatsink
No

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

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