This particular cooler is definitely impressive and effective for its size, pleasantly surprising, as it manages to keep the Ryzen 7 3700X at around 70°C at 4.3GHz all cores with one fan, and at 66-67°C with a second fan during an AIDA64 stress test (ambient temp around 26-27°C). In idle with the PC simply on, it stays below 40°C, and with light usage around 45-47°C. Of course, the way the CPU is configured in the UEFI/BIOS also plays a role, so that the voltage it receives does not spike, as well as the airflow of the tower (which in this case was relatively good). The aforementioned performance is noteworthy in any case, considering the compact size of the cooler.

The cooler comes with a second set of clips for an additional fan in a push-pull configuration. There is a flat cold plate for application to the CPU, with direct contact with the copper heat pipes, which, although there are four of them, seem to provide good heat dissipation. The very dense fin mesh is certainly remarkable and has a further positive effect on cooling performance. (For better information, you can check the max TDP in watts that the cooler can handle on the manufacturer's website.)

The provided fan is definitely of high quality. It cannot be described as noisy, although it reaches around 2000-2100 RPM during stress tests, i.e., under extreme conditions: at a distance of 3 meters from the tower, I doubt anyone can distinguish its contribution to the (bearable) noise that is inevitably created from others - lower speed (around 1000-1500 RPM) - that the case "wears." The fan comes with an extension cable for connecting a second fan to the same motherboard header for the CPU cooler.

Conclusion: This is a very good case of a modern compact CPU cooler, especially if the available space in your case is relatively limited.

[A general comment without the possibility of substantiation, due to a lack of specialized knowledge: the newer CPU air coolers, although relatively short, seem to come with design improvements, with better application of the cold plate and, occasionally, with denser fin mesh for good heat dissipation (or maintaining high performance at high temperatures) in the new generations of AMD and Intel CPUs.]